IC Packaging Engineer – WLP

Do you like to work on groundbreaking technology? Have a passion for creating amazing products? Our team is looking for a hardworking, IC Packaging Engineer with strong attention to details and love for excellence and precision to accomplish extraordinary results. In this highly impactful role, you will initiate package concepts, own and drive sophisticated package selection, new product package structure and configuration optimization. You will be responsible for packaging integration and package technology development for a variety of projects including SoC.

Key Responsibilities:

• Lead packaging technology development including advanced 2.5D/3D packaging.
• Work with multi-functional team and lead SoC Package integration efforts.
• Package Architecture / Package Integration Innovation
• Work with foundry and OSAT to bring packaging solution from concept to HVM.
• Drive industry with sophisticated Package solutions, new material development, and specs.
• 5% International travel.

Minimum Qualifications:

• BS and 3+ years of relevant industry experience.

Preferred Qualifications:

• Experience working in the Semiconductor Packaging field.
• Knowledge of materials characterization and analysis.
• Proven understanding of Wafer Level Packaging, 2.5D packaging and 3D packaging technology.
• General understanding of packaging technologies, assembly processes, IC packaging materials, reliability standards, FA techniques, etc.
• Excellent interpersonal skills and strong business partnership building and collaboration with multi-functional teams and overseas suppliers.
• Ability to work independently and orchestrate projects with minimum supervision.
• Solution-oriented engineer with proven fundamentals in engineering and physics.
• Shown capabilities using package design software, APD, Virtuoso, etc.
• Knowledge of the latest developments in memory packaging.
• Good program management skills.

Join Apple and be part of a team creating amazing products and pushing the boundaries of technology in IC packaging!