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R&D Engineer Adv Tech Dev (PKE) / Sr. Staff

A global technology leader that designs, develops and supplies semiconductor and infrastructure software solutions.
Singapore
Embedded
Staff Software Engineer
In-Person
5,000+ Employees
8+ years of experience
Semiconductor

Description For R&D Engineer Adv Tech Dev (PKE) / Sr. Staff

Broadcom, a global leader in semiconductor and infrastructure software solutions, is seeking a Senior Staff R&D Engineer for their Advanced Technology Development team. This role focuses on advanced silicon node products (5nm, 3nm, 2nm and beyond), combining expertise in IC packaging, materials science, and engineering. The position involves working closely with cross-functional teams to design and implement cutting-edge packaging solutions that meet complex technical requirements.

The role requires deep technical knowledge in signal integrity, power integrity, and thermal management for advanced semiconductor packages. You'll be responsible for managing the entire IC packaging lifecycle, from concept through high-volume production, while working with various stakeholders including business units, design teams, and external suppliers.

This is an excellent opportunity for an experienced professional with a strong background in semiconductor packaging and materials science. The position offers exposure to the latest semiconductor technologies and the chance to work on innovative solutions for next-generation silicon products. The role combines technical expertise with project management and leadership responsibilities, making it ideal for someone looking to advance their career in semiconductor technology development.

Broadcom offers an inclusive work environment and values diversity in its workforce. The company's location in Singapore-Yishun puts you at the heart of Asia's semiconductor industry, working with cutting-edge technology and world-class teams.

Last updated a day ago

Responsibilities For R&D Engineer Adv Tech Dev (PKE) / Sr. Staff

  • Work with business unit marketing and IC design teams to select optimum package solutions
  • Design custom packages with IC design, system design, package SI/PI & thermal engineering teams
  • Research, develop, and productize new materials for advanced node silicon
  • Manage IC packaging from concept through development, qualification and production
  • Define assembly BOM, process, troubleshoot packaging issues
  • Create package design documentation and assembly instructions
  • Interface with packaging assembly and substrate suppliers
  • Work with QA and customers to resolve quality issues
  • Support NPI bring-up, package qualification, and production support

Requirements For R&D Engineer Adv Tech Dev (PKE) / Sr. Staff

  • BS/MS/PHD in STEM/Material Science/Electrical/Mechanical Engineering
  • BS +8 years or MS +6 years or PhD + 3 years of experience
  • Deep understanding of signal integrity and power integrity concepts
  • Strong authority on Cadence APD for custom substrate design
  • Expertise in advanced assembly processes for flipchip, MCM packages
  • Understanding of materials related to Chip Packaging Interaction
  • Knowledge of advanced substrate manufacturing/process
  • Strong project management, communication and leadership skills
  • Knowledge of GD&T and mechanical drawings
  • Understanding of manufacturing and quality engineering fundamentals

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