Broadcom, a global leader in semiconductor and infrastructure software solutions, is seeking a Senior Staff R&D Engineer for their Advanced Technology Development team. This role focuses on advanced silicon node products (5nm, 3nm, 2nm and beyond), combining expertise in IC packaging, materials science, and engineering. The position involves working closely with cross-functional teams to design and implement cutting-edge packaging solutions that meet complex technical requirements.
The role requires deep technical knowledge in signal integrity, power integrity, and thermal management for advanced semiconductor packages. You'll be responsible for managing the entire IC packaging lifecycle, from concept through high-volume production, while working with various stakeholders including business units, design teams, and external suppliers.
This is an excellent opportunity for an experienced professional with a strong background in semiconductor packaging and materials science. The position offers exposure to the latest semiconductor technologies and the chance to work on innovative solutions for next-generation silicon products. The role combines technical expertise with project management and leadership responsibilities, making it ideal for someone looking to advance their career in semiconductor technology development.
Broadcom offers an inclusive work environment and values diversity in its workforce. The company's location in Singapore-Yishun puts you at the heart of Asia's semiconductor industry, working with cutting-edge technology and world-class teams.