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Thin Films Module Engineer Interview Experience - Hillsboro, Oregon

March 29, 2019
Positive ExperienceGot Offer

Process

1-hour phone screening.

Interview day:

  • Meet with group leader.
  • Present Ph.D. work (1 hour) to a group.
  • Individual interviews (1 hour per interviewer, 6 total).
  • Lunch with the group's engineers.
  • Fab window tour.
  • Wrap up with the hiring chair.

Questions

Why apply for Intel?

  • Experience with certain equipment used in my Ph.D. work.

What is the least you liked during your Ph.D. study?

More general questions about my presentation, technical or academic types.

Conflict resolution with peers or an advisor.

  • Experience working within a group.

Ask them questions.

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Interview Statistics

The following metrics were computed from 4 interview experiences for the Intel Thin Films Module Engineer role in Hillsboro, Oregon.

Success Rate

75%
Pass Rate

Intel's interview process for their Thin Films Module Engineer roles in Hillsboro, Oregon is incredibly easy as the vast majority of engineers get an offer after going through it.

Experience Rating

Positive100%
Neutral0%
Negative0%

Candidates reported having very good feelings for Intel's Thin Films Module Engineer interview process in Hillsboro, Oregon.

Intel Work Experiences