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Thin Films Module Engineer Interview Experience - Hillsboro, Oregon

March 7, 2021
Positive ExperienceGot Offer

Process

The interview process was long but friendly.

It started with a phone screen from an engineer, which lasted about an hour. A month later, I was contacted to schedule the panel interview.

On the panel interview day, I had six interviews with the hiring manager, group leaders, and fellow engineers, among others. I also gave my own research presentation.

The questions were mostly based on my presentation and resume, focusing on how I solved each problem and why I chose particular techniques.

Questions

Troubleshooting instruments, conflicts with workers, a particular problem in your PhD that you had solved. When do you stop troubleshooting yourself and ask for help?

Did you ever modify a machine?

Basics of SEM, CVD, XRD, etc.

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Interview Statistics

The following metrics were computed from 4 interview experiences for the Intel Thin Films Module Engineer role in Hillsboro, Oregon.

Success Rate

75%
Pass Rate

Intel's interview process for their Thin Films Module Engineer roles in Hillsboro, Oregon is incredibly easy as the vast majority of engineers get an offer after going through it.

Experience Rating

Positive100%
Neutral0%
Negative0%

Candidates reported having very good feelings for Intel's Thin Films Module Engineer interview process in Hillsboro, Oregon.

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