The whole process was remote (online).
Phase 1: An Intel recruiter emailed me to apply for this position as I had been referred internally by an Intel employee whom I met at a conference (perks of going to conferences).
Then, I received an email from a senior team member for a phone interview, which was about 45 minutes to an hour long. It was mostly like a conversation with occasional specific questions about my Ph.D. research, troubleshooting experiences, etc.
Tip: Be excited when you converse, show great interest in the company and the role. It is all about convincing them why they should spend an entire day knowing you more.
Phase 2: About a couple of days later, the hiring manager from the team emailed to set up a whole-day interview. This consisted of seven 1-on-1 interviews (with the whole team, including engineers, group leaders, and a senior engineering manager) and a 1-hour presentation on my Ph.D. work.
All the interviews mostly focused on what I did during my Ph.D., the research equipment I worked with, why I did what I did, troubleshooting, experience with my advisor, fellow grad students, conflict resolutions with lab mates and my advisor, safety protocols, and my grasp on research methodology.
Tip: Identify different situations from your experience to address questions on these topics and be ready to recall them when asked, as many questions will be asked.
Time was given after each interview to ask questions, so prepare many questions about the role, company, team, etc.
Phase 3: After the interview, I received an email for a background check after 2 days, which was a good sign. Finally, I got the offer a week after the interview.
Research experience
Conflict resolutions
Importance to safety
Mistakes you made
What you learned from mistakes
Working in a team
How to tell a senior/teammate that they are wrong
The following metrics were computed from 4 interview experiences for the Intel Thin Films Module Engineer role in Hillsboro, Oregon.
Intel's interview process for their Thin Films Module Engineer roles in Hillsboro, Oregon is incredibly easy as the vast majority of engineers get an offer after going through it.
Candidates reported having very good feelings for Intel's Thin Films Module Engineer interview process in Hillsboro, Oregon.