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Thin Films Module Engineer Interview Experience - Hillsboro, Oregon

May 1, 2019
Positive ExperienceGot Offer

Process

Initial phone screening lasting about 30 minutes. Standard resume questions.

Interview Day:

  • Meet with the group leader.
  • Present your Ph.D. work (approximately 45 minutes) to a group of people.
  • Individual interviews (casual conversations, questions about the presentation, experience with lab equipment, and behavioral questions).
  • Lunch with the group's engineers.
  • Fab window tour.
  • Wrap up with the hiring chair.

After about 6 weeks, I received an offer.

Questions

Why Intel?

Troubleshooting experience with certain equipment.

How do you resolve conflict with your advisor or peers?

General questions about my presentation.

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Interview Statistics

The following metrics were computed from 4 interview experiences for the Intel Thin Films Module Engineer role in Hillsboro, Oregon.

Success Rate

75%
Pass Rate

Intel's interview process for their Thin Films Module Engineer roles in Hillsboro, Oregon is incredibly easy as the vast majority of engineers get an offer after going through it.

Experience Rating

Positive100%
Neutral0%
Negative0%

Candidates reported having very good feelings for Intel's Thin Films Module Engineer interview process in Hillsboro, Oregon.

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