Principal Photonics/Semiconductor Packaging Engineer - Acacia
Description For Principal Photonics/Semiconductor Packaging Engineer - Acacia
Acacia, a part of Cisco, designs intelligent transceivers using advanced signal processing and photonic integration for the 100G, 400G and 1T bit speed fiber optic transmission market deployed in data center, metro, long-haul and ultra-long haul telecommunication networks.
As a Principal Photonics/Semiconductor Packaging Engineer at Acacia, you will play a key role in the design, development, and transfer to production of leading-edge transceivers utilizing silicon photonics and advanced DSP technology. Your responsibilities will include:
- Developing new package architecture and integration concepts
- Working with OSATs to bring new products to volume production
- Solving technical problems encountered in product prototyping, qualification, and production
- Driving product solutions toward high-performance, high-reliability and low-cost
You will be part of a multi-disciplinary team, including optical, mechanical, electrical, and manufacturing engineers. You'll collaborate closely with Acacia's Silicon Photonics development team on new product designs and with the Product Engineering and Quality teams to ensure smooth transition of products to Manufacturing.
The ideal candidate has deep knowledge of semiconductor packaging and a great understanding of how to make high-volume, high-reliability products. You should be enthusiastic about engineering and seeing your effort contribute to real-world applications. Detail-oriented and eager to tackle difficult technical problems, you can work independently but thrive in a friendly, team-oriented, collaborative work environment.
Cisco offers a competitive compensation package, including quality medical, dental and vision insurance, a 401(k) plan with company matching, paid time off, and numerous wellbeing offerings. Join Cisco to be part of a company that's powering an inclusive future for everyone through innovative technology.
Responsibilities For Principal Photonics/Semiconductor Packaging Engineer - Acacia
- Develop new package architecture and integration concepts
- Work with OSATs to bring new products to volume production
- Solve technical problems encountered in product prototyping, qualification, and production
- Drive product solutions toward high-performance, high-reliability and low-cost
- Collaborate with Silicon Photonics development team on new product designs
- Work with Product Engineering and Quality teams to ensure smooth transition of products to Manufacturing
Requirements For Principal Photonics/Semiconductor Packaging Engineer - Acacia
- BS degree with 12+ years of experience in photonics/semiconductor packaging or a Master's/Ph.D. with 10+ years of experience in photonics/semiconductor packaging
- 10+ years of experience with semiconductor assembly processes such as die bonding, wire-bonding and 2.5D/3D assembly
- Knowledge of back-end wafer processing
- Knowledge of materials characterization and failure analysis, IC packaging materials and back-end wafer-level processes
- Knowledge of SiPh/PIC packaging, including mechanical, thermal, optics, and RF aspects
- Great interpersonal and communication skills
Benefits For Principal Photonics/Semiconductor Packaging Engineer - Acacia
- Quality medical, dental and vision insurance
- 401(k) plan with Cisco matching contribution
- Short and long-term disability coverage
- Basic life insurance
- Numerous wellbeing offerings
- Up to twelve paid holidays per calendar year
- One floating holiday
- Day off for birthday
- Up to 20 days of Paid Time Off (PTO) accrual each year
- Paid time for volunteering and community service
- Employee Stock Purchase Program
