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Senior Packaging Research and Development Engineer

Google is a global technology company that builds innovative computing solutions and products.
Goleta, CA, USA
$174,000 - $258,000
Embedded
Senior Software Engineer
In-Person
5,000+ Employees
6+ years of experience
Hardware

Description For Senior Packaging Research and Development Engineer

Google's Quantum AI team is seeking a Senior Packaging Research and Development Engineer to tackle complex packaging challenges in quantum computing hardware. This role focuses on developing advanced packaging interconnect technologies for packaging cryogenic microwave devices, crucial for the next generation of quantum computers.

The position requires deep expertise in MEMS/semiconductor packaging, with responsibilities spanning 3D silicon, PCB, and MEMS packaging technologies. The successful candidate will collaborate with researchers and engineers internally, as well as external academic and industrial partners, to advance packaging technologies for higher signal density and improved signal integrity.

This is an exciting opportunity to work at the cutting edge of quantum computing technology, contributing to Google's mission of building a large-scale quantum computer capable of complex, error-corrected computations. The role combines hands-on technical work with project leadership, requiring both deep technical knowledge and strong collaborative skills.

The compensation package is competitive, with a base salary range of $174,000-$258,000, plus bonus, equity, and comprehensive benefits. The position is based in Goleta, CA, offering the chance to work with world-class researchers and engineers in Google's Quantum AI division.

Key responsibilities include developing and characterizing advanced packaging solutions, writing documentation, managing vendor relationships, and executing test plans. The ideal candidate will bring curiosity and engineering intuition to improve superconducting quantum hardware system performance, contributing to Google's quantum computing roadmap.

This role offers the unique opportunity to work on breakthrough technology that could revolutionize computing, while being supported by Google's resources and collaborative culture. The position combines the excitement of fundamental research with the practical challenges of engineering implementation, making it ideal for someone passionate about pushing the boundaries of what's possible in quantum computing hardware.

Last updated a day ago

Responsibilities For Senior Packaging Research and Development Engineer

  • Collaborate with academic and industrial partners as a project technical lead for technology development
  • Write documentation and transfer newly developed processes to in-house or external production
  • Scope and purchase tools needed for process development of microwave interconnect technologies
  • Write and execute test plans to assess packaging performance
  • Perform research and development of PCB and silicon/3D/MEMS based advanced packaging

Requirements For Senior Packaging Research and Development Engineer

  • Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, Physics, or a specialized field, or equivalent practical experience
  • 6 years of experience working in a Research and Development packaging technical environment
  • 5 years of experience in MEMS/semiconductors advanced packaging including design, development, and testing
  • 5 years of experience in characterization of reliability and yield of advanced electronics packaging hardware
  • 5 years of experience in package techniques including 3D integration, wire bonding, bump bonding, land grid array, through-silicon vias, electrical contacts, micro machining

Benefits For Senior Packaging Research and Development Engineer

Medical Insurance
Dental Insurance
Vision Insurance
401k
Parental Leave
  • Bonus
  • Equity
  • Benefits package

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