Engineer, HIG-HBM Product Engineering (Media Health Manufacturing)

Micron Technology is seeking an experienced Engineer for their High Bandwidth Memory (HBM) Product Engineering team. This role combines technical leadership with hands-on engineering work in the development and optimization of HBM products. The position focuses on leading manufacturing test flow development, improving device/stacked yield, and driving Design for Test (DFT) strategies. The ideal candidate will work at the intersection of hardware engineering and test optimization, collaborating with cross-functional teams including Fab, Product Leads, Design, and Technology Development.

The role requires deep technical expertise in circuit analysis, test coverage optimization, and manufacturing processes. You'll be responsible for ensuring the quality, cost-effectiveness, and reliability of Micron's HBM products. This includes both DRAM and Interface die components, as well as stacked products. The position offers the opportunity to work on cutting-edge memory technology while leading and mentoring a team.

Key aspects of the role include optimizing test coverage, developing and validating new products, improving manufacturing yields, and driving innovation in test strategies. The successful candidate will need to balance technical expertise with leadership skills, making critical decisions about risk analysis and project prioritization while fostering team development.

This is an excellent opportunity for someone passionate about memory technology and looking to make a significant impact in a leadership role at a company that's transforming how the world uses information. The position offers the chance to work on innovative products while developing both technical and leadership skills in a dynamic, fast-paced environment.