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OCI Thermal Engineering Intern (Burlington, MA)

Oracle is the world's leading provider of business software. With a presence in over 175 countries, we are one of the biggest technology companies on the planet.
Burlington, MA, USA
$39,500 - $110,240
Embedded
Software Engineering Intern
In-Person
5,000+ Employees
Enterprise SaaS
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Description For OCI Thermal Engineering Intern (Burlington, MA)

The Oracle Hardware Development (OHD) organization in Burlington, MA is looking for a Thermal Mechanical intern to work with our mechanical and thermal design team to support all phases of our development life-cycle, including design, simulation, documentation, and testing/validating prototype thermal designs and measuring airflow in our HW lab.

We are seeking elite students with the expertise and passion for solving challenging unique problems. You will use your knowledge and creativity to design and build innovative new systems from the ground up. You will be working on new and challenging thermal and mechanical designs, handle mechanical and thermal models, performing thermal and airflow simulations and testing new thermal solutions in our labs. You will have the opportunity to work on cutting-edge technologies to tackle real-world problems in a collaborative, agile environment.

Qualifications:

  • Currently enrolled in a Bachelor's or Master's degree in Mechanical Engineering, Thermal Engineering or an equivalent science/engineering field.
  • Must be returning to the degree program after completion of the internship.
  • Reside in the United States and/or attend a university in the US.
  • Able to obtain work authorization in the US in 2025.
  • Academic coursework, completed projects, prior internship and/or research experience in at least three of the following areas: Mechanical Engineering, Thermodynamics, Fluid Mechanics, Heat Transfer, Materials Science, Control System, Mechanical Design, Systems Engineering.
  • Proven experience in at least two of the following areas: Industry Standard MCAD tools, Digital thermometers, Pressure Gauges, PCB Design, Computational Fluid Dynamics (CFD) Modeling, Electronic Packaging.

Preferred Qualifications:

  • Experience with CREO and FlowTherm
  • Minimum Cumulative GPA of 3.0 or higher

Benefits:

  • High-impact projects
  • Mentorship program
  • World-class training
  • Fun-filled summer events
  • Comprehensive benefits package including medical, dental, and vision insurance
  • 401(k) Savings and Investment Plan with company match
  • Paid time off and holidays
  • Paid parental leave
  • Employee Stock Purchase Plan

Oracle is an Equal Employment Opportunity Employer and is committed to including people with disabilities at all stages of the employment process.

Last updated 9 months ago

Responsibilities For OCI Thermal Engineering Intern (Burlington, MA)

  • Work with mechanical and thermal design team
  • Support all phases of development life-cycle
  • Design and simulate thermal solutions
  • Document designs and processes
  • Test and validate prototype thermal designs
  • Measure airflow in hardware lab
  • Design and build innovative new systems
  • Handle mechanical and thermal models
  • Perform thermal and airflow simulations
  • Work on cutting-edge technologies to solve real-world problems

Requirements For OCI Thermal Engineering Intern (Burlington, MA)

Java
  • Currently enrolled in a Bachelor's or Master's degree in Mechanical Engineering, Thermal Engineering or equivalent
  • Returning to degree program after internship completion
  • Reside in the US or attend a US university
  • Able to obtain US work authorization in 2025
  • Experience in at least three areas: Mechanical Engineering, Thermodynamics, Fluid Mechanics, Heat Transfer, Materials Science, Control System, Mechanical Design, Systems Engineering
  • Experience in at least two areas: MCAD tools, Digital thermometers, Pressure Gauges, PCB Design, CFD Modeling, Electronic Packaging
  • Preferred: Experience with CREO and FlowTherm
  • Preferred: Minimum 3.0 GPA

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