Telematics Chipset Principal Project Engineer
Description For Telematics Chipset Principal Project Engineer
Qualcomm, a global leader in 5G technology and innovation, is seeking a Principal Project Engineer to join their Telematics Chipset Hardware Systems team in Bangalore, India. This role represents an exciting opportunity to shape the future of automotive connectivity and technology.
The position involves leading chipset definition, productization, and hardware architecture for telematics systems, working at the forefront of automotive technology innovation. As a key member of the team, you'll be responsible for understanding and implementing solutions that bridge the gap between current automotive architectures and future connectivity needs, with a focus on supporting product lifecycles of up to 15 years.
The role requires a unique blend of technical expertise and leadership skills, as you'll be guiding cross-functional teams in designing, validating, and sustaining roadmap needs. Your work will directly impact the development of next-generation advanced connectivity modules in future vehicles, making this an excellent opportunity for someone passionate about automotive technology and innovation.
Key aspects of the role include working with advanced technologies across Digital, PMIC, and Analog systems, managing product development from conception through qualification and production, and ensuring adherence to automotive-grade reliability standards. You'll be involved in everything from SoC design to package integration, requiring a comprehensive understanding of electrical, mechanical, power, and thermal challenges in automotive environments.
The ideal candidate will bring extensive experience in systems engineering or related fields, with a strong background in SoC development and automotive systems. Knowledge of automotive standards (AECQ, ASIL, APQC) and experience with reliability testing are crucial. This role offers the opportunity to work with cutting-edge technology while contributing to the future of connected vehicles.
Working at Qualcomm means being part of a company that values innovation and diversity, with a strong commitment to transforming industries through technology. The position offers the chance to work with dedicated experts and industry leaders while developing solutions that will shape the future of automotive connectivity.
This role would be ideal for someone who thrives in a fast-paced environment, enjoys solving complex technical challenges, and wants to be at the forefront of automotive technology innovation. Join Qualcomm in this exciting role and be part of the team that's defining the future of connected vehicles.
Responsibilities For Telematics Chipset Principal Project Engineer
- Lead chipset definition, productization and hardware architecture for telematics systems
- Understanding evolving automotive car architectures and connectivity module integration
- Lead cross-functional team of experts to design, validate and sustain roadmap needs
- Work with SoC Design, DV, DFT, SVE and test/packaging teams
- Drive product through life-cycle to achieve quality, cost and DPPM goals
- Address electrical, mechanical, power and thermal challenges
- Manage qualification testing, debugs and productizations
- Work with customers to resolve quality issues and concerns
Requirements For Telematics Chipset Principal Project Engineer
- Bachelor's degree in Engineering, Information Systems, EE Engineering or related field
- 7+ years Systems Engineering or related work experience
- Experience with reliability testing (AECQ100 preferred)
- Experience in developing SoCs from Product/Design development background
- Experience with advanced technologies across Digital, PMIC, and Analog
- Knowledge of packaging, modules and/or PCB development for SoCs
- Experience in working with product development and marketing teams
- Understanding of automotive ecosystem, AECQ, ASIL, APQC, PPAP processes
