IC Package Design Engineer

Do you like to work on groundbreaking technologies that enable amazing new products? Do you have the attention for details and love for excellence to work towards an extraordinary result? Envision what you could do here! At Apple, we believe new insights have a way of becoming extraordinary products, services, and customer experiences very quickly. Bring passion and dedication to your job and there's no telling what you could accomplish!

Our Hardware Technology Packaging team invents, designs, develops and integrates electronic packaging solutions for Apple's internal and custom external components of hardware for its consumer electronic products such as iPhone, iPad, Mac, Apple Watch, Apple TV, etc.

In this highly visible role, you will own and drive sophisticated package selection, new generation product package structure and configuration optimization. You will be responsible for Package/SIP/module physical design and layout, optimization, design verification and tape out; and work with multi-functional teams to achieve optimized mechanical / electrical / thermal performance for various types of chips.

Key Responsibilities:

• Implement the physical design of packages and modules for SoC, Memory, RF and cellular chips.
• Define and develop design verification and automation strategy to strengthen and streamline package design and release flows.
• Drive methodology, innovations, and efficiency improvements in package design together with vendors and developers on feature development and bug resolution.
• Interface and coordinate with cross-functional groups throughout Apple on new product package/SiP/module feasibility analysis, design and selection.
• Ensure package design is optimized with SI/PI requirements.
• Explore, evaluate and develop new CAD tool, design and verification flow.
• Collaborate in multi-functional discussions for package architecture and technology roadmap.
• Identify and drive cost saving opportunities and/or performance enhancing features.
• Perform extraction of S-parameters and package RLGC model.

Required Qualifications:

• BS and 10+ years hands-on experience with package design and proficient in Cadence Allegro platform tools or Mentor Xpedition platform tools.
• Solid fundamentals in electrical/material/thermal/mechanical engineering field.
• Familiarity with various sophisticated package configurations and assembly / substrate technology.
• Experience with SI/PI tools, package model extraction, S-parameters and RLGC model.
• Knowledge of substrate manufacturing process, structure, design rules and material property.
• Solid understanding of high-speed interfaces, including DDR, PCIe, NAND, etc.
• Exposure to Unix environment, scripting languages (PERL, Python, TCL and or shell) and methodology.
• Good understanding of system specification and IC design.
• Consistent track record to drive package selection through feasibility studies and drive chip Floor planning and bump assignment.

Apple offers a comprehensive benefits package, including medical and dental coverage, retirement benefits, stock options, and educational reimbursement opportunities. The base pay range for this role is between $175,800 and $312,200, with additional opportunities for bonuses, commissions, and relocation assistance.