Broadcom is seeking a Senior Staff R&D Engineer for Advanced Technology Development focusing on package engineering. This role combines technical expertise in semiconductor packaging with leadership responsibilities, working at the cutting edge of silicon node products (5nm, 3nm, 2nm and beyond). The position involves collaborating with multiple teams to design, develop, and implement advanced packaging solutions that meet stringent technical requirements. The ideal candidate will have deep technical knowledge in package engineering, signal integrity, and manufacturing processes, while also possessing strong project management and communication skills. This role offers the opportunity to work with cutting-edge technology at a global semiconductor leader, contributing to next-generation product development while interfacing with tier #1 external customers and leading cross-functional teams. The position requires a blend of technical expertise, innovation capability, and leadership skills, making it an excellent opportunity for experienced professionals looking to work at the forefront of semiconductor technology.