Broadcom, a global leader in semiconductor and infrastructure software solutions, is seeking an experienced R&D IC Design Engineer to join their team. This role focuses on developing chips for Physical Layer Products in High-Speed Optical Communication, working with cutting-edge technologies including 10G to 800G Ethernet and OTN networks. The position offers a comprehensive compensation package including a salary range of $141,000 - $225,000, plus bonus and equity opportunities.
The ideal candidate will be responsible for architecting block-level designs, RTL coding, and various aspects of IC design validation and testing. They will work with advanced technologies including ARM subsystems, FEC design, and digital signal processing. The role requires extensive experience in IC development, from initial design through silicon production qualification.
This is an excellent opportunity for a seasoned professional with 10+ years of experience who enjoys IC development work and thrives in a collaborative environment. The position offers the chance to work on innovative solutions at one of the world's leading semiconductor companies, with competitive benefits including medical, dental, vision insurance, 401(k) matching, and equity programs.
The role demands strong technical expertise combined with excellent communication skills, as you'll be working with teams across different time zones. If you're passionate about IC design, have a strong background in digital circuit design, and want to be part of developing next-generation communication technologies, this position offers an exciting career opportunity at Broadcom.