Broadcom, a global leader in semiconductor and infrastructure software solutions, is seeking a Staff R&D Engineer for Advanced Technology Development. This role represents a unique opportunity to work at the cutting edge of semiconductor technology, combining expertise in integrated-circuit process technologies with semiconductor assembly.
The position requires deep technical knowledge in semiconductor device fabrication, device modeling, and circuit design. You'll be responsible for managing projects from concept through high-volume manufacturing, working with both internal teams and external foundry partners. The role involves risk assessment and coordination of cross-functional technology initiatives, making it ideal for someone who excels at both technical leadership and project management.
Key aspects of the role include working with advanced silicon and packaging process technologies, including FinFET and Gate All Around technology, 2.5D packaging, and 3D stacked IC. You'll be involved in everything from IP and chip design to yield analysis and technology roadmapping. The position offers exposure to cutting-edge semiconductor technology while working with cross-functional teams across manufacturing, technology, and packaging.
The compensation package is competitive, ranging from $119,000 to $190,000 annually, plus discretionary bonus and equity opportunities. Broadcom offers comprehensive benefits including medical, dental, and vision insurance, 401(k) with company matching, ESPP, and various leave benefits. The company culture promotes diversity and inclusion, making it an excellent environment for professional growth in the semiconductor industry.
This role is perfect for someone with 8+ years of experience who wants to be at the forefront of semiconductor technology advancement while working for a global technology leader. The position offers the opportunity to make significant contributions to next-generation semiconductor technologies while working with some of the industry's best minds.