Join Google's ML, Systems, & Cloud AI (MSCA) organization as a Custom Datapath Physical Design Engineer working on cutting-edge TPU (Tensor Processing Unit) technology. This role focuses on implementing ASICs in advanced technology nodes, specifically for AI/ML hardware acceleration. You'll be instrumental in shaping the future of Google's TPU technology that powers demanding AI/ML applications.
Working on the Chip Implementation team, you'll leverage your expertise in custom design to improve chip efficiency, collaborating closely with front-end and back-end designers. The position involves developing custom silicon solutions that power Google's TPU architecture and its integration within AI/ML-driven systems.
The role offers an opportunity to work on technology that impacts billions of users through Google services and Google Cloud. You'll be part of an organization that prioritizes security, efficiency, and reliability while pushing the boundaries of hyperscale computing. The team's impact extends to crucial projects like Google Cloud's Vertex AI, the leading AI platform for enterprise customers using Gemini models.
This is an ideal position for someone with deep expertise in ASIC physical design, custom datapath design, and advanced process nodes. You'll work with industry-standard EDA CAD tools, optimize design power, and drive innovations in custom design approaches. The role offers competitive compensation, including base salary, bonus, equity, and comprehensive benefits, reflecting Google's commitment to attracting top talent in silicon design.