BSP Engineer - Shenzhen

Qualcomm, a global leader in technology innovation, is seeking a BSP (Board Support Package) Engineer to join their Customer Engineering team in Shenzhen. This role sits at the intersection of hardware and software, focusing on enabling next-generation Internet of Everything devices including Wearables, Smart POS, VR/AR, IP Cameras, and Robotics.

The position offers a unique opportunity to work with world-leading device makers, developing and implementing solutions that push the boundaries of what's possible in embedded systems. As a BSP Engineer, you'll be responsible for understanding customer requirements, analyzing Linux kernel and Android userspace code, and co-developing custom solutions. You'll work closely with cross-functional teams worldwide, including chip, platform, product, and software development teams.

The ideal candidate will bring strong expertise in embedded systems development, particularly with Linux kernel 5.x/6.x, and proficiency in languages like C, C++, and Java. Experience with kernel architecture, USB debugging, and power architecture is crucial for success in this role. The position requires both technical excellence and strong customer engagement skills, as you'll be supporting customers throughout the entire product lifecycle - from initial design through to launch and maintenance.

Qualcomm offers a comprehensive benefits package including world-class health coverage, financial planning support, and wellbeing programs. The company strongly emphasizes professional growth through continuous learning opportunities, tuition reimbursement, and mentorship programs. This role presents an excellent opportunity to work at the forefront of technology innovation while developing your career with a global leader in the semiconductor industry.