IC Package Layout Engineer, Up to Senior Staff

Qualcomm is seeking a talented IC Package Layout Engineer to join their team in Hsinchu City, Taiwan. This role offers an exciting opportunity to work at the forefront of 5G technology and semiconductor innovation. As an IC Package Layout Engineer, you'll be responsible for driving advanced package selection, physical design, and optimization of next-generation products.

The position requires expertise in package/SIP physical design, layout, and tape-out processes, working closely with cross-functional teams to achieve optimal mechanical, electrical, and thermal performance. You'll be implementing physical designs for SoC packages and modules while ensuring compliance with SI/PI requirements.

The ideal candidate brings 5+ years of experience and strong proficiency in Cadence APD & SiP tools, along with deep knowledge of IC packaging structures and high-speed interfaces. This role offers growth opportunities within Qualcomm's innovative environment, where you'll work alongside leading engineering experts.

Qualcomm provides comprehensive benefits including world-class health coverage, financial planning support, and professional development through tuition reimbursement and mentorship programs. The company's culture emphasizes work-life balance with wellbeing programs and emotional/mental health support.

This position is perfect for someone passionate about semiconductor technology who wants to contribute to world-changing innovations while developing their career at a global technology leader. You'll be part of a team that's shaping the future of connectivity and mobile technology.