Low Power ASIC Engineer (Next-Gen, High-Speed Memory Subsystem)

Qualcomm, the world's leading wireless IC manufacturer and largest fabless semiconductor company, is seeking a Low Power ASIC Engineer for their next-generation high-speed memory subsystem team. This role focuses on developing cutting-edge solutions for mobile, automotive, compute, AI, and XR applications in sub-4nm process technology.

The position offers an exciting opportunity to work with state-of-the-art technology in a fast-paced environment, where you'll be responsible for critical power analysis and optimization of memory subsystem designs. You'll collaborate with cross-functional teams to deliver high-performance, energy-efficient solutions that power the next generation of electronic devices.

The ideal candidate will bring extensive experience in power analysis and optimization, using industry-standard tools like PowerArtist and PrimeTime PX. You'll be involved in all aspects of the ASIC development lifecycle, from architecture definition to final implementation, working alongside some of the industry's leading experts in semiconductor design.

Qualcomm offers an exceptional compensation package, including competitive base salary, annual bonuses, and equity grants. The company provides comprehensive benefits including health coverage, 401(k), continuing education support, and wellness programs. Located in San Diego, you'll be working at the heart of innovation in wireless technology, contributing to products that impact billions of users worldwide.

This role represents an excellent opportunity for experienced engineers looking to advance their careers in low-power ASIC design while working on cutting-edge technology that shapes the future of wireless communications, automotive systems, and artificial intelligence applications.