Qualcomm is seeking a Senior SIPI (Signal Integrity and Power Integrity) Engineer to join their Package Electrical Team. The role involves working with package and IC designers to optimize overall package design, ensuring system-level constraints are met prior to package Tape-out. The candidate will collaborate with various teams including PHY, PCB, and PSIG to provide timely feedback and update design guidelines.
Key responsibilities include:
- Performing package extraction for time domain and frequency domain analysis
- Conducting system-level analysis for DDR, SerDes & Mixed signal interfaces
- Providing design guidelines for Package design
- Developing and automating design & analysis flow
- Creating technical documentation and presentations
The ideal candidate will have:
- 3+ years of experience in DDR/SerDes in Package/PCB/System Design related to mobile standards
- Strong background in Electromagnetics and transmission line theory & Crosstalk
- Proficiency in field solvers such as HFSS, Q3D, Sentinel-PSI, and Clarity
- Experience with simulation tools like ADS and Hspice
- Working knowledge of Cadence Allegro/APD/Sip or Mentor Xpedition
Preferred qualifications include:
- Experience in programming (C/C++) or scripting (Perl/Python)
- Experience with Matlab for automating simulation flows
- Familiarity with design specifications such as LPDDRx, MIPI(CSI, DSI), PCIe, UFS
- Master's Degree with 3-4 years of experience (Ph.D. with minimal experience also considered)
This role offers the opportunity to work on cutting-edge technology in the field of signal and power integrity, contributing to the development of advanced mobile and communication systems. Join Qualcomm's team of inventors and be part of shaping the future of connectivity and technology.